High-Speed Flexible Mounter-SHENZHEN ETA ELECTRONIC EQUIPMENT CO.,LTD._

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High-Speed Flexible Mounter

MOQ ：1 piece

Lead Time ：20 Days

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Seller Support : Trade Authenticity Guaranteed & Accepting

Payment : L/C,T/T,Credit Card,Western Union,Money Gram,Money Order,Pay Pal

Departure Port : Shenzhen

Product details

Supply Ability

Supply Ability：100 piecesWarranty(Year)：8 Year

Packaging & Delivery

Length：120 cmWidth：130 cm
Height：160 cm
Packaging：1 piece

Product Specifications

Product Description

Chip
20, 200CPH(laser centering/Optimum)(0.178Sec. /chip)
16, 700CPH(laser centering/IPC9850)
IC
1, 850CPH (vision centering / effective tact)
2, 860CPH with MNVC option.
One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
From 0402 (01005) to 74mm square components or 50× 150mm
Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)

1 Actual throughput may vary.

2 Please download brochure for details.

Board size	M size (330×250mm)		0
	L size (410×360mm)		0
	L-Wide size(510×360mm) (option)		0
	E size (510×460mm)*1		0
Component size	Laser recognition		0402 (01005)~33.5mm
	Vision recognition	Standard camera	3mm~74mm or 50×150mm
		High-resolution camera (option)	1.0×0.5mm*3~48mm or 24×72mm
Placement speed	Chip	Optimum	0.178Sec./chip(20,200CPH)
		IPC9850	16,700CPH
	IC*4		1,850CPH
			4,860CPH*5
Placement accuracy	Laser recognition		±0.05mm(Cpk>=1)
	Vision recognition		±0.03mm (±0.04mm when using MNVC)
Feeder inputs			Max. 80 on 8mm T/F*6

Please ask for details on E size board.

When using MNVC. (option)

When using high-resolution camera. (option)

Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.

(CPH=number of components placed for one hour)

Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.

Including matrix tray changer, max 110.