High-Speed Chip Shooter-SHENZHEN ETA ELECTRONIC EQUIPMENT CO.,LTD._

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High-Speed Chip Shooter

MOQ ：1 piece

Lead Time ：20 Days

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Seller Support : Trade Authenticity Guaranteed & Accepting

Payment : L/C,T/T,Credit Card,Western Union,Money Gram,Money Order,Pay Pal

Departure Port : Shenzhen

Product details

Supply Ability

Supply Ability：100 piecesWarranty(Year)：16 Year

Packaging & Delivery

Length：120 cmWidth：130 cm
Height：160 cm
Packaging：1 piece

Product Specifications

Product Description

Chip
23, 300CPH(laser centering/Optimum)(0.155Sec. /chip)
18, 300CPH(laser centering/IPC 9850)
IC
4, 600CPH (vision centering with optional MNVC)
One multi-nozzle laser head (6 nozzles)
From 0402 (01005) to 33.5mm square components
Vision centering system (optional, featuring bottom, side, and back lighting, all ball recognition)
1 Actual throughput may vary.
2 Please download brochure for details.

Board size	M size (330×250mm)		0
	L size (410×360mm)		0
	L-Wide size(510×360mm) (option)		0
	E size (510×460mm)*1		0
Component size	Laser recognition		0402 (01005) ~33.5mm
	Vision recognition	Standard camera	3mm*2 ~33.5mm
		High-resolution camera (option)	1.0×0.5mm*3 ~20mm
Placement speed	Chip	Optimum	0.155Sec./chip(23,300CPH)
		IPC9850	18,300CPH
	IC*4		4,600CPH*5
Placement accuracy	Laser recognition		±0.05mm(Cpk>=1)
	Vision recognition		±0.04mm
Feeder inputs			Max. 80 on 8mm T/F*6

Please ask for details on E size board.

When using MNVC. (option)

When using both high-resolution camera and MNVC. (option)

Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.

(CPH=number of components placed for one hour)

Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.

Including matrix tray changer, max 110.