SMT Infrared BGA Reflow Oven , The Professional SMT
Sm Excen New Generation - Small Footprint Chipshooter 120k CPH
MOQ ：1 piece
Lead Time ：20 Days
Seller Support : Trade Authenticity Guaranteed & Accepting
Payment : L/C,T/T,Credit Card,Western Union,Money Gram,Money Order,Pay Pal
Departure Port : Shenzhen
Product details
Supply Ability
- Supply Ability：100 piecesWarranty(Year)：8 Year
Packaging & Delivery
- Length：140 cmWidth：150 cm
- Height：160 cm
- Packaging：1 piece
Product Specifications
Product Description
World's Highest Area Productivity
A high speed modular mounter using a high speed rotary head equipped with 16 nozzles. EXCEN has the world's highest speed in the world among mounters of the same class as well as the world's highest area productivity. In addition, it secures the reliability of fine chip placement by using the function to monitor pre- and post-part placement, SVS (Side-view Vision System), and maximizes work convenience and actual productivity by applying various operation modes including non-stop device type change, mixed production of different boards as well as the SMART Feeder that realizes the world's first Auto Splicing and Auto Loading functions.
Features:
120, 000 CPH(Optimum)
Ultra Slim Design with a Total Length of 1.25m
High Speed Rotary Modular Head
Side-view Vision System(SVS) - Monitoring of pre- and post-part placement
Mixed Production of Different Boards
Independent Production at the Front and Rear/
Non-stop Change-over of Device Types
High Speed and High Precision Feeder
SMART Feeder - The world's first Auto Splicing and Auto Loading functions
Placement Rate: 120'000cph(9850IPC)
Placement Accuracy: ± 50μ @3σ /Chip
Component Range: 01005~8mm2 By vision (Fixed Type Cameras)
Max Height = 3mm
PCB Size: 330mm X 250mm
PCB Thickness: 0.3 ~ 4mm
Feeder Capacity: 120 X 8mm by Docking Cart (30Each)
External Dimensions: 1250mm(L) X 2420mm(D) X 1430mm(H)
Options:
Multi Function Head Option (76'000cph)
01005~18mm2 , H=8mm
IC/Connector Lead pitch @ 0.5mm
BGA/CSP Ball pitch @ 0.3mm
A high speed modular mounter using a high speed rotary head equipped with 16 nozzles. EXCEN has the world's highest speed in the world among mounters of the same class as well as the world's highest area productivity. In addition, it secures the reliability of fine chip placement by using the function to monitor pre- and post-part placement, SVS (Side-view Vision System), and maximizes work convenience and actual productivity by applying various operation modes including non-stop device type change, mixed production of different boards as well as the SMART Feeder that realizes the world's first Auto Splicing and Auto Loading functions.
Features:
120, 000 CPH(Optimum)
Ultra Slim Design with a Total Length of 1.25m
High Speed Rotary Modular Head
Side-view Vision System(SVS) - Monitoring of pre- and post-part placement
Mixed Production of Different Boards
Independent Production at the Front and Rear/
Non-stop Change-over of Device Types
High Speed and High Precision Feeder
SMART Feeder - The world's first Auto Splicing and Auto Loading functions
Placement Rate: 120'000cph(9850IPC)
Placement Accuracy: ± 50μ @3σ /Chip
Component Range: 01005~8mm2 By vision (Fixed Type Cameras)
Max Height = 3mm
PCB Size: 330mm X 250mm
PCB Thickness: 0.3 ~ 4mm
Feeder Capacity: 120 X 8mm by Docking Cart (30Each)
External Dimensions: 1250mm(L) X 2420mm(D) X 1430mm(H)
Options:
Multi Function Head Option (76'000cph)
01005~18mm2 , H=8mm
IC/Connector Lead pitch @ 0.5mm
BGA/CSP Ball pitch @ 0.3mm
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- Trade Assurance
Business Type : Manufacturer
Company Location:
Year Established: 17YRS
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